System and method for increasing die yield

ABSTRACT

The present invention systems and methods facilitate increased die yields by flexibly changing the operational characteristics of functional components in an integrated circuit die. The present invention system and method enable integrated circuit chips with defective functional components to be salvaged. Defective functional components in the die are disabled in a manner that maintains the basic functionality of the chip. A chip is tested and a functional component configuration process is performed on the chip based upon results of the testing. If an indication of a defective functional component is received, the functional component is disabled. Workflow is diverted from disabled functional components to enabled functional components.

RELATED APPLICATIONS

This application claims the benefit of commonly-owned U.S. PatentProvisional Application Ser. No. 60/503,710, filed Sep. 15, 2003,entitled “A SYSTEM AND METHOD FOR CONFIGURING SEMICONDUCTOR FUNCTIONALCOMPONENTS” which is hereby incorporated by this reference.

This application is also related to the following Applications:

U.S. patent application Ser. No. 10/740,721, entitled “AN INTEGRATEDCIRCUIT CONFIGURATION SYSTEM AND METHOD”, filed on Dec. 12, 2003;

U.S. patent application Ser. No. 10/740,722, entitled “A SYSTEM ANDMETHOD FOR CONFIGURING SEMICONDUCTOR FUNCTIONAL CIRCUITS”, filed on Dec.18, 2003;

U.S. patent application Ser. No. 10/740,779, entitled “A SYSTEM ANDMETHOD FOR REMOTELY CONFIGURING SEMICONDUCTOR FUNCTIONAL CIRCUITS”,filed on Dec. 18, 2003;

U.S. patent application Ser. No. 10/876,340, entitled “SYSTEM AND METHODFOR TESTING AND CONFIGURING SEMICONDUCTOR FUNCTIONAL CIRCUITS”, filed onJun. 23, 2004;

U.S. patent application Ser. No. 10/942,169, entitled “MICRO ELECTROMECHAMCAL SWITCH SYSTEM AND METHOD FOR TESTING AND CONFIGURINGSEMICONDUCTOR FUNCTIONAL CIRCUITS”, filed on Dec. 15, 2004;

U.S. patent application Ser. No. 11/454,313, entitled “FUNCTIONALCOMPONENT COORDINATED RECONFIGURATION SYSTEM AND METHOD”, filed on Jun.16, 2006;

U.S. patent application Ser. No. 11/472,865, entitled “FUNCTIONALCOMPONENT COMPENSATION RECONFIGURATION SYSTEM AND METHOD”, filed on Jun.21, 2006; and

U.S. patent application Ser. No. 10/942,209, entitled “SEMICONDUCTOR DIEMICRO ELECTRO-MECHANICAL SWITCH MANAGEMENT SYSTEM AND METHOD”, filed onSep. 15, 2004;

FIELD OF THE INVENTION

The present invention relates to the field of semiconductormanufacturing. In particular, the present invention relates to a systemand method for dynamically configuring operational characteristics offunctional components within an integrated circuit.

BACKGROUND OF THE INVENTION

Electronic systems and circuits have made a significant contributiontowards the advancement of modern society and are utilized in a numberof applications to achieve advantageous results. Numerous electronictechnologies such as digital computers, calculators, audio devices,video equipment, and telephone systems have facilitated increasedproductivity and reduced costs in analyzing and communicating data inmost areas of business, science, education and entertainment. Electronicsystems providing these advantageous results often include integratedcircuits. It is desirable to utilize integrated circuits with very highreliability characteristics to prevent erroneous results. However,designing and building integrated circuits with diverse functionalityand performance characteristics is challenging. Additionally, themanufacturing process to build the integrated circuits is highly complexand resource intensive.

Manufacturing integrated circuits is an expensive, resource intensiveactivity, in which numerous computational components are included in asingle integrated circuit unit. The computational components are usuallyrequired to be capable of performing a variety of tasks with very highreliability. Various applications often require different performancelevels and functionality. Traditionally, each die is fabricated with apredetermined quantity of properly performing components providing setfunctionality. However, providing appropriate and efficientfunctionality at acceptable reliability is often difficult. For example,many traditional approaches require that there be few or no defectivecomponents included in the integrated circuit.

Conventionally, integrated circuits are manufactured in waferscomprising a number of die, with each die comprising an integratedcircuit having numerous functional components. The number of die thatare functionally acceptable from a given wafer is referred to as theyield from the wafer. It is desirable to maintain relatively high yieldsin order to eliminate waste, save cost and speed-up the effectivemanufacturing time for a given number of die. Yields for wafers withhigh performance die with a large number of components can be very low.

One method used by memory chip makers for mitigating the impact of theoccurrence of defective components within an integrated circuit die isto produce the die with more components, e.g. memory cells, thanrequired. If there is a defective component the defective component isdisconnected and one of the “surplus” components is utilized. Thisapproach usually results in considerable waste of precious die area andresources on fabricating components that remain “surplus” even afterreplacing defective components. Such surplus components do notcontribute to functionality and/or operational productivity. Asignificant number of die end up having numerous “surplus” componentswith perfectly good operational capabilities that are not utilized.

Another traditional attempt at addressing defective components is toremove functional capability if one functional component associated witha particular function is defective. For example, if a floating pointacceleration component of a processor is defective, the floating pointacceleration functionality is removed or disabled using conventionalrepair techniques, and the processor becomes a non-floating pointacceleration processor. In addition, the end result is a usableintegrated circuit with limited capability and that does not provide afull range of functionality (e.g., not able to perform floating pointoperations).

SUMMARY

The present invention systems and methods enable configuration offunctional components in integrated circuits. A present invention systemand method can flexibly change the operational characteristics offunctional components in an integrated circuit die based upon a varietyof factors including manufacturing defects, compatibilitycharacteristics, performance requirements, and system health (e.g., thenumber of components operating properly). In one embodiment, a presentinvention configuration system includes functional components, adistribution component, a functional component configuration controllerand optionally a collection component. The functional components performprocessing operations (e.g., graphics processing operations, floatingpoint operations, etc.). The distribution component distributes workflowinformation (e.g., graphics processing information, floating pointprocessing information, etc.) to the functional components. Thefunctional component configuration controller configures operationalcharacteristics of the functional components. The collection component“collects” the output or results from the functional components andaggregates the results of the operations for use in achieving a commonobjective.

In one exemplary implementation, the changes to operationalcharacteristics of a functional component are coordinated with changesto other functional components. Workflow scheduling and distribution isalso adjusted based upon the changes to the operational characteristicsof the functional components. For example, the functional componentconfiguration controller changes the operational characteristicssettings and provides an indication of the changes to a workflowdistribution component. The workflow distribution component changes theworkflow schedule based upon the operational characteristics settings.For example, the work flow is diverted to or away from particularfunctional components.

The present invention system and method enable integrated circuit chipswith defective functional components to be salvaged and facilitateincreased wafer yield in integrated circuit manufacturing in oneembodiment. Traditionally, the integrated circuits with the defectivefunctional components would otherwise be discarded resulting in thecosts of producing a wafer being assigned to fewer acceptable die. Inone embodiment, a present invention system and method disables defectivefunctional components in the die in a manner that maintains the basicfunctionality of the chip.

In one embodiment of the present invention, integrated circuit salvagingis performed in conjunction with chip testing. A chip is tested (e.g.,in accordance with a built in self test) and defective functionalcomponents of the chip are identified. A determination is made if adefective functional component is one which does not have anotherfunctional component included in the die that is similar. In oneembodiment, a distinction is made if the die does not have anotherfunctional component that can handle the work flow if the defectivefunctional component is disabled. If such a defective functionalcomponent is identified, the die may be discarded since the die couldnot provide full functionality. If other functional components existthat can be used to perform the functionality of the defectivecomponent, a functional component configuration process (e.g.,functional component configuration process 400) is performed on the chipbased upon results of the testing.

In one embodiment of the present invention, the functional componentconfiguration process disables defective functional components includedin a chip. An indication of the defective functional componentidentification is received. A determination is made if the defectivefunctional component is one of a plurality of similar functionalcomponents. In one embodiment of the present invention, the identifieddefective component (e.g., a pixel shader, vertex processor, floatingpoint component, etc.) is compared against a list of other similarcomponents that can provide the same functionality. In one exemplaryimplementation, the other similar components are examined to determineif they are parallel components to the defective functional component.The defective functional component is disabled if it is one of theplurality of similar functional components and another component canhandle the workflow that would otherwise be assigned to the defectivecomponent. In one embodiment of the present invention, functionalcomponents associated with the defective component can also be disabled(e.g., to maintain product differentiation). Workflow is diverted fromthe disabled component.

In one embodiment, diverting the workflow is accomplished by providingnotification of the disablement to a component that otherwisecommunicates information to the defective functional component. Forexample, a disabling component provides an indication (e.g., a bit map)to the distributor component and the distributor component does notprovide information to the defective functional component. Instead, thework flow is diverted to other similar functional components.

In one embodiment of a present invention salvage method, definitions ofcharacteristics of a die for a particular performance level are includedand a die is marked accordingly. In one exemplary implementation, thetest includes an indication of what defects are permissible in eachperformance level. For example, the test can include a first performancelevel in which a first plurality of parallel functional components canbe disabled and a second performance level in which a second pluralityof parallel functional components can be disabled. The present inventioncan also facilitate automatic binning of the die based upon performancelevels as part of the testing procedure.

In one embodiment, centralized resources are utilized in theconfiguration of remote integrated circuits. A remote functionalcomponent configuration architecture facilitates configuration offunctional components included in a remotely located integrated circuitdie. In one exemplary implementation a die functional componentreconfiguration request process is engaged in wherein a system requestsa reconfiguration code from a remote resource. The code request includesa reconfiguration code permission indicator that indicates the requesteris authorized to receive a reconfiguration code (e.g., the requester hasmade a requisite payment, has an authorized system, etc.). Areconfiguration code production process is executed in which a requestfor a reconfiguration code and a permission indicator are received,validity of the permission indicator is analyzed, and a reconfigurationcode is provided. A die functional component reconfiguration process isperformed on the die when an appropriate reconfiguration code isreceived by the die.

DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and form a part ofthis specification, illustrate embodiments of the invention by way ofexample and not by way of limitation. The drawings referred to in thisspecification should be understood as not being drawn to scale except ifspecifically noted.

FIG. 1A is a block diagram of an integrated circuit in accordance withone embodiment of the present invention.

FIG. 1B is a block diagram of an integrated circuit having functionalcomponents organized in pipelines in accordance with one embodiment ofthe present invention.

FIG. 1C is a block diagram of a multiprocessor integrated circuit inaccordance with one embodiment of the present invention.

FIG. 1D is a block diagram of an exemplary mask array implementation inaccordance with one embodiment of the present invention to controldifferent objectives.

FIG. 2 is a block diagram of a computer system in which embodiments ofthe present invention can be implemented.

FIG. 3 is a block diagram of a graphics pipeline in accordance with oneembodiment of the present invention.

FIG. 4 is a flow chart of a functional component configuration method inaccordance with one embodiment of the present invention.

FIG. 5 is a flow chart of a reduced performance circuit salvage methodin accordance with one embodiment of the present invention.

FIG. 6 is a block diagram of a testing environment in accordance withone embodiment of the present invention.

FIG. 7 is a flow chart of a die classification process in accordancewith one embodiment of the present invention.

FIG. 8 is a block diagram of a processing unit in accordance with oneembodiment of the present invention.

FIG. 9 is a flow chart of a wafer yield optimization method inaccordance with one embodiment of the present invention.

FIG. 10 is a block diagram of a functional component configurationarchitecture in accordance with one embodiment of the present invention.

FIG. 11 is a flow chart of a remote reconfiguration method in accordancewith one embodiment of the present invention.

DETAILED DESCRIPTION

Reference will now be made in detail to the preferred embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. While the invention will be described in conjunction with thepreferred embodiments, it will be understood that they are not intendedto limit the invention to these embodiments. On the contrary, theinvention is intended to cover alternatives, modifications andequivalents, which may be included within the spirit and scope of theinvention as defined by the appended claims. Furthermore, in thefollowing detailed description of the present invention, numerousspecific details are set forth in order to provide a thoroughunderstanding of the present invention. However, it will be obvious toone of ordinary skill in the art that the present invention may bepracticed without these specific details. In other instances, well knownmethods, procedures, components, and circuits have not been described indetail as not to unnecessarily obscure aspects of the present invention.

Some portions of the detailed descriptions which follow are presented interms of procedures, logic blocks, processing, and other symbolicrepresentations of operations on data bits within a computer memory.These descriptions and representations are the means generally used bythose skilled in data processing arts to effectively convey thesubstance of their work to others skilled in the art. A procedure, logicblock, process, etc., is here, and generally, conceived to be aself-consistent sequence of steps or instructions leading to a desiredresult. The steps include physical manipulations of physical quantities.Usually, though not necessarily, these quantities take the form ofelectrical, magnetic, optical, or quantum signals capable of beingstored, transferred, combined, compared, and otherwise manipulated in acomputer system. It has proven convenient at times, principally forreasons of common usage, to refer to these signals as bits, values,elements, symbols, characters, terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare associated with the appropriate physical quantities and are merelyconvenient labels applied to these quantities. Unless specificallystated otherwise as apparent from the following discussions, it isappreciated that throughout the present application, discussionsutilizing terms such as “processing”, “computing”, “calculating”,“determining”, “displaying” or the like, refer to the action andprocesses of a computer system, or similar processing device (e.g., anelectrical, optical, or quantum, computing device), that manipulates andtransforms data represented as physical (e.g., electronic) quantities.The terms refer to actions and processes of the processing devices thatmanipulate or transform physical quantities within a computer system'scomponent (e.g., registers, memories, other such information storage,transmission or display devices, etc.) into other data similarlyrepresented as physical quantities within other components.

FIG. 1A is a block diagram of integrated circuit 100 in accordance withone embodiment of the present invention. Integrated circuit 100comprises distribution component 110, functional component configurationcontroller 120, collection component 140 and functional components 131,132, 133 and 134. Distribution component 110 is coupled to functionalcomponents 131, 132, 133 and 134, which are coupled to collectioncomponent 140. Functional component configuration controller 120 iscoupled to distribution component 110, functional components 131, 132,133 and 134, and collection component 140. In one embodiment of thepresent invention, the components of integrated circuit 100 are includedin a single die. The components of integrated circuit 100 cooperativelyoperate to perform information processing (e.g., data manipulation). Inone exemplary implementation, the components of integrated circuit 100perform information processing related to a common objective (e.g.,graphics pipeline processing associated with producing an image).

Distribution component 110 selectively distributes information tofunctional components 131-134 (e.g., enabled functional components). Itis appreciated that distribution component 110 can distribute a varietyof information. For example, distribution component 110 can distributeworkflow information. The workflow information can be information ordata for processing in association with a common objective. For example,the workflow information can be graphics related information (e.g., asingle stream of information in which various parts of the informationstream include pixel information for sequentially configured pixels ofan image). In one exemplary implementation, distribution component 110receives a single stream of workflow information or data (e.g., graphicsdata) and distributes the workflow information to functional components131-134. For example, the single stream of information can includeinformation related to a first pixel, a second pixel, and a third pixel.Distribution component 110 receives the single stream of pixelinformation (e.g., a sequence of packets) and distributes theinformation (e.g., as individual packets) related to the first pixel tofunctional component 131, the information related to the second pixel tofunctional component 132 and the information related to the third pixelto functional component 133. In another exemplary implementation, thedistribution component 110 receives a single stream of informationrelated to floating point calculations and distributes informationassociated with a first floating point calculation to functionalcomponent 131, information associated with a second floating pointcalculation to functional component 132, and information associated witha third floating point calculation to functional component 133. In oneembodiment, distribution component 110 can also receive multipleinformation streams and distribute the information to the functionalcomponents 131-134. It is appreciated that distribution component 110can be implemented in a variety of embodiments, including embodiments inwhich distribution component 110 provides functions or performs tasks inaddition to distributing the workflow information.

Functional components 131-134 can include a variety of implementationsin which the functional components 131-134 perform different functionaloperations or tasks. In one embodiment functional components 131-134provide similar functionality (e.g., perform parallel operations). Forexample, in one embodiment functional components 131-134 can performgraphics processing related tasks (e.g., shading, texturing, occlusionculling, etc). In another embodiment, functional components 131-134 canperform floating point related processing.

Collection component 140 “collects” the output or results fromfunctional components 131-134. In one embodiment, collection component140 concatenates or aggregates the results of the operations for use inachieving the common objective. For example, the collection component140 can aggregate the results for communication to a graphics buffer. Inanother embodiment, the collection component 140 is a graphics buffer.In yet another embodiment, collection component 140 can aggregate theresults of floating point calculations.

The components of integrated circuit 100 also cooperatively operate toflexibly configure functional component operational characteristics(e.g., enable/disable a functional component, change clock speed, changeoperating voltage, etc.). Functional component configuration controller120 controls adjustments in operational characteristics (e.g.,disable/enable, etc.) of one or more of the functional components131-134 and can provide information to distribution component 110 andcollection component 140 regarding the adjustment. For example,functional component configuration controller 120 can disable or enablea functional component (e.g., disable or enable functional component132). Functional component configuration controller 120 can notifydistribution component 110 of the change to functional component 132operating characteristics (e.g., which of the functional components isenabled, disabled, etc.).

Distribution component 110 can use information about the operationalcharacteristics of functional component 132 in distributing workflowinformation. In one embodiment, the distribution component 110 canfactor the configuration of the functional components into distributionof information (e.g., workflow including data for processing) to thefunctional components. If one of the processor functional components isdisabled (e.g., because it is defective), distribution component 110distributes the information to the other remaining processor functionalcomponents to handle the “work flow”. For example, if functionalcomponent 132 is disabled by functional component configurationcontroller 120, distribution component 110 is notified that functionalcomponent 132 is disabled and distribution component 110 can routeworkflow to other functional components (e.g., 131, 133, and/or 134). Iffunctional component 132 is enabled by functional componentconfiguration controller 120, distribution component 110 is notifiedthat functional component 132 is enabled and distribution component 110can route workflow to functional component 132. Distribution component110 can also distribute the information to remaining enabled functionalcomponents based upon the performance configuration (e.g., clock speed)of the functional components. In one exemplary implementation, taskswith greater performance demands (e.g., critical tasks) are routed tofunctional components with greater performance characteristics orcapabilities (e.g., faster). For example, three dimensional (3D)graphics information can be routed to a high performance (e.g., highspeed) graphics pipeline and two dimensional (2D) graphics informationcan be routed to a lower performance (e.g., slower speed) graphicspipeline. In one embodiment the information is distributed in accordancewith scoreboarding algorithms.

In one embodiment of the present invention, functional componentconfiguration controller 120 directs changes to operationalcharacteristics of functional components 131-134. The operationalcharacteristics can impact the performance of functional components131-134. For example, functional component configuration controller 120can change an operational characteristic state of functional components131-134 (e.g., enable or disable the functional component). In oneexemplary implementation, functional component configuration controller120 can alter the speed at which a functional component operates (e.g.,by changing a clock frequency) and/or the power consumed by a functionalcomponent (e.g., by changing the voltage supplied to the functionalcomponent). For example, functional component configuration controller120 can direct clock source 137 to change a frequency of a clock signalsupplied to functional components 131-134 and/or power supply 138 tochange the voltage of a power signal supplied to functional components131-134.

It is appreciated that the present invention is readily adaptable forutilization with a variety of functional components. Functionalcomponents 131-134 can be functional units that provide a variety ofdifferent functions (e.g., floating point, pixel shading, vertexshading, storage, buffering, etc.). In one exemplary implementation, thefunctional components can perform similar operations at substantiallythe same time (e.g., concurrently in parallel). In one embodiment of thepresent invention, the functional components are active functionalcomponents.

In one embodiment, the functional components are processor components(e.g., floating point components, pixel shader components, vertexprocessor components, etc.) included in a processing unit. It isappreciated that the present invention can be readily implemented in avariety of processing units, including a central processing unit (CPU),a graphics processing unit (GPU), and/or an embedded processing unit. Inone exemplary implementation, the processing unit includes ascoreboarding algorithm for allocating tasks to the processor functionalcomponents (e.g., floating point components). As results are processedby the processor functional components the scoreboard tracks whichoperand is required by a processor functional component and schedulesit. The results from the individual processor functional components canbe combined to provide an overall result. The scoreboard can factor afunctional component configuration into the scheduling of tasks. Forexample, if one of the processor functional components is disabled(e.g., because it is defective), the scoreboard reschedules the otherremaining processor functional components to handle the processing workflow.

The present invention can be implemented in a pipeline type (e.g., avector type, thread type, etc.) processing environment. FIG. 1B is ablock diagram of pipeline integrated circuit 150 in accordance with oneembodiment of the present invention. Pipeline integrated circuit 150 isan implementation of integrated circuit 100 in which the functionalcomponents are pipelines. Integrated circuit 150 comprises distributioncomponent 151, functional component configuration controller 152,collection component 154 and pipelines 171, 172, 173 and 174. Pipelines171, 172, 173 and 174 perform pipeline operations (e.g., fetch, decodeand execute instructions). Functional component configuration controller152 controls the operational characteristics of pipelines 171 through174 and also provides information to distribution component 151 andcollection component 154 regarding operational characteristics ofpipelines 171 through 174 (e.g., information regarding which of thefunctional components is disabled and/or enabled). The control ofoperational characteristics can be performed at varying granularity. Forexample, a pipeline can include multiple individual functionalcomponents (not shown) within each pipeline which can also be configured(e.g., enabled, disabled, etc.) on an individual functional componentbasis.

The components of pipeline integrated circuit 150 operate similar to thecomponents of integrated circuit 100. For example, workflow informationis diverted or routed in a similar manner. Functional componentconfiguration controller 152 provides information to distributioncomponent 151 regarding the operational characteristics of thefunctional components 171-174 (e.g., disabled, enabled, speed, voltage,etc). Distribution component 151 distributes information to thepipelines 171-174 based in part upon the operation characteristicinformation (e.g., distributes workflow information to enabledfunctional components and not disabled functional components).Collection component 140 “collects” (e.g., concatenates or aggregates)the output of pipelines 171-174 (e.g., concatenates or aggregates theresults for storage in a graphics buffer). In one embodiment, functionalcomponent configuration controller 152 can direct clock source 175 tochange a frequency of a clock signal supplied to functional components171-174 and/or power supply 177 to change the voltage of a power signalsupplied to functional components 171-174.

A present invention integrated circuit can be implemented at a varietyof integration levels (e.g., a variety of die hierarchies andarchitectures). FIG. 1C is a block diagram of multiprocessor integratedcircuit 190, another embodiment of a present invention die hierarchy.The components of multiprocessor integrated circuit 190 are similar tointegrated circuit 100 except the functional components are processors.Multiprocessor integrated circuit 190 comprises distribution component191, functional component configuration controller 192, collectioncomponent 194 and processors 195, 197, 198 and 199. In one embodiment,processors 195, 197, 198 and 199 are included in a single die andcoupled to a common cache memory. Functional component configurationcontroller 192 can direct operational characteristics adjustments (e.g.,disables/enables) to one or more of the processors 195-199 and providesoperational characteristic information to distribution component 191 andcollection component 194 indicating the operational characteristics ofprocessors 195-199 (e.g., indicates if a processor is disabled/enabled).In one exemplary implementation, integrated circuit 190 still providescomplete functionality even if functional component configurationcontroller 192 disables a processor (e.g., 195, 197, 198, or 199).

The components of multiprocessor integrated circuit 190 operate similarto the components of integrated circuit 100. For example, workflowinformation is diverted or routed in a similar manner. Functionalcomponent configuration controller 192 provides information todistribution component 191 regarding operational characteristics of thefunctional components (e.g., disabled, enabled, speed, voltage, etc).Distribution component 191 distributes information (e.g., workflow data)to the processors 195-199. The distribution is based in part upon theoperation characteristic information (e.g., distributes workflowinformation to enabled functional components and not disabled functionalcomponents). In one exemplary implementation, collection component 194is a memory (e.g., a common cache) which “collects” or stores the outputof processors 195-199. In one embodiment, functional componentconfiguration controller 192 can direct clock source 181 to change afrequency of a clock signal supplied to functional components 195-199and/or power supply 182 to change the voltage of a power signal suppliedto functional components 195-199.

A distinction is made between performance and functionality in oneembodiment of the present invention. In some instances, the presentinvention does not limit functionality when changing operationalcharacteristics in the sense that a particular type of function or taskis still capable of being performed even though the function or task maybe accomplished at a different performance level. In one embodiment, afunctional component configuration controller does not disable all thefunctional components capable of performing tasks in parallel. Forexample, if a die has two parallel floating point functional componentsin a processor and functional component configuration alters theenablement characteristic or state (e.g., disables) one of the floatingpoint functional components, the work flow is “rerouted” to theremaining enabled floating point functional components. The performancelevel of floating point activities may change (e.g., slow down) sincethe work flow is being handled by one floating point functionalcomponent instead of two. However, the die still has the ability toprovide the same functionality or task (e.g., perform the floating pointfunctions).

In one embodiment of the present invention, integrated circuits (e.g.,integrated circuit 100, integrated circuit 150, integrated circuit 190,etc.) are marked with a performance indicator that corresponds to theperformance capabilities (e.g., the number of functional components thatare enabled and/or disabled). The marking can be an electronicallyreadable marking and/or an ink marking (e.g., on a die). The marking canbe an indicator of the quality rating of the integrated circuit. Themarking can also correspond to a performance metric associated with theintegrated circuit (e.g., a processing speed, bandwidth, etc.).

It is appreciated that the functional component configurationcontrollers 120, 152, and/or 192 can direct functional component changesin accordance with a variety of objectives. For example, a functionalcomponent configuration controller can alter operational characteristicsof functional components based upon yield issues, compatibility issues,performance issues, system “health” issues, etc. It is also appreciatedthat functional component configuration controllers 120, 152, and/or 192can include a variety of implementations to achieve the objectives,including a software programmable register or mask, hardcoded mask, etc.

In one embodiment, a functional component configuration controller(e.g., 120, 152 and/or 192) directs changes in the operationalcharacteristics of functional components to address yield issues. Thepresent invention has the benefit of facilitating increased wafer yieldin integrated circuit manufacturing. A present invention system andmethod enables integrated circuits with some defective functionalcomponents to be salvaged. Traditionally, die with defective functionalcomponents are discarded resulting in the costs of producing a waferbeing assigned to fewer acceptable die. The present invention permitssome die with defective functional units to be used to perform the sametypes of functions and thereby maintain functionality even though thedisablement of the defective components may impact performance.Increasing the number of useful die on a wafer permits the cost of waferproduction to be assigned to a greater number of acceptable die. Bypermitting the fixed cost of wafer production to be assigned to agreater number of die, the cost per die can decrease, even though thelower performing die may be sold at a lower price.

The present invention facilitates “salvaging” of die even though some ofthe die may operate at different performance levels. In one exemplaryimplementation, the die that would otherwise be discarded are able toprovide the same functionality in the sense that the die execute thesame type of tasks. For example, a processor with parallel floatingpoint functional components capable of performing floating pointoperations is still able to perform floating point operations since inone embodiment the present invention does not disable all the parallelfloating point components and “reroutes” workflow from the disabledparallel floating point components to the remaining floating pointcomponents. Die with more disabled components may perform the tasks at adifferent level (e.g., slower) because some parallel components aredisabled. However, the die still has the ability to provide the samefunctionality (e.g., perform the same tasks).

In one embodiment, a functional component configuration controller(e.g., 120, 152 and/or 192) directs operational characteristic changes(e.g., enable, disable, etc.) to functional components duringmanufacturing testing. For example, a functional component configurationcontroller (e.g., 120, 152 or 192) disables a functional component(e.g., 132, 173, or 198 respectively) if testing indicates thefunctional component is defective and enables a functional component(e.g., 131, 174, 197 respectively) if testing indicates the functionalcomponent is not defective.

In one embodiment of the present invention, a functional componentconfiguration controller (e.g., 120, 152 and/or 192) directs changes inthe operational characteristics of functional components to address“self health” issues. In one exemplary implementation, the functionalcomponent controller addresses self health issues in the “field” orafter initial shipment from the manufacturer. In one exemplaryimplementation, an integrated circuit is capable of running in the field“self-health” tests. For example, if a “self-health” test results in anindication of a defective functional component, a functional componentconfiguration controller (e.g., 120, 152 and/or 192) disables thedefective functional component and provides an indication that thefunctional component is disabled to a distribution component (e.g., 110,150, or 191). In one embodiment of the present invention, the selfhealth test is compliant with International Electrical and ElectronicEngineering (IEEE) Standard 1149.1 (also referred to as Joint TaskAction Group (JTAG) testing). In an alternate embodiment, the selfhealth test is a proprietary test for checking the operational integrityof the system. In yet another embodiment, a functional component isenabled if a “self health” test in the field indicates the functionalcomponent is not defective.

In yet another embodiment, if a non-enabled non-defective functionalcomponent that performs similar types of tasks or functions as adefective functional component is available, the non-enabled nondefective functional component is enabled if the defective component isdisabled. For example, integrated circuit 100 of FIG. 1 can be initiallyshipped with functional components 131 and 132 enabled and functionalcomponents 133 and 134 disabled even through they are non defective(e.g., for market segmentation reasons, etc.). If a field self healthtest later indicates that functional component 132 becomes defective,functional component controller 120 can disable functional component 132and enable functional component 133 and work flow that would have flowedto functional component 132 if it was not disabled is distributed (e.g.,by distribution component 110) to functional component 133. Thus,disabling functional component 132 in effect removes the problemsassociated with defects in functional component 132, while enablingpreviously disabled functional component 133 permits the same type offunctionality or tasks to be performed on the workflow at the sameperformance level and thereby the system is effectively “self healing”.

In one embodiment of the present invention, a functional componentconfiguration controller (e.g., 120, 152 and/or 192) directs changes inthe operational characteristics of functional components to addresscompatibility issues. In one embodiment, a functional componentcontroller included in a graphics accelerator is capable of recognizingchipsets that are compatible with features of the graphics acceleratorand changes operational characteristics of the graphics acceleratoraccordingly. For example, if the functional component configurationcontroller is controlling operational characteristics of graphicspipelines, the functional component configuration controller can enablea higher number of graphics pipelines if the chip set supports it and iscompatible with the utilization of a higher number of graphicspipelines. For example, a graphics accelerator and a chip set aremanufactured by the same manufacturer and the functional componentcontroller included in the graphics accelerator can receive a signalidentifying a chip set included in the same system as the graphicsaccelerator. In one embodiment of the present invention, compatibilityis established by a driver and a functional component controller directschanges to the operational characteristics of the functional componentsaccordingly.

In one embodiment of the present invention, a functional componentconfiguration controller (e.g., 120, 152 and/or 192) directs changes inthe operational characteristics of functional components to addressperformance issues. In one embodiment, performance mask 40 provides anindication of operational characteristics for functional componentsbased upon performance issues. For example, a particular application isbeing run and desirable supported functional component operationalcharacteristics are enabled. If the application is a graphicsapplication additional graphics pipelines can be enabled and/or theclock speed of existing graphics application pipelines can be increased.In one embodiment of the present invention, the type of the system canbe factored into performance operational changes, for example in mobiledevices the performance can be adjusted to conserve power.

It is appreciated that there are a variety of functional componentconfiguration controller embodiments for implementing functionalcomponent changes in accordance with different objectives. FIG. 1D is ablock diagram of mask array 10 utilized by a functional componentcontroller in accordance with one embodiment of the present invention tocontrol different objectives. Each mask in the mask array can correspondto a particular operational objective. In one exemplary implementation,mask array 10 comprises yield mask 20, compatibility mask 30,performance mask 40, and self healing mask 50. In one exemplaryimplementation, each column 11 through 18 is associated with one ofeight functional components. Each cell (e.g., cell 99) includes anoperational characteristic setting value. For example, an operationalcharacteristic setting value of logical one can correspond to enablingthe functional component, a high clock speed for the component, a highvoltage level for the component, etc. Conversely an operationalcharacteristic setting value of logical zero can correspond to disablingthe functional component, a low clock speed for the component, a lowvoltage level for the component, etc. It is appreciated that the presentinvention is readily adaptable for operational characteristic settingvalues that have varying increments of granularity (e.g., very highspeed, high speed, medium speed, low speed, very low speed). In oneexemplary implementation, mask array 10 is implemented in a registerarray.

Priorities can be assigned to the different objectives or masks. Forexample, yield mask 20 can be assigned a higher priority thanperformance mask 40. In this example, the operational characteristicsetting value in cell 98 controls over the operational characteristicsetting value in cell 97. If the setting value in cell 98 indicates thatthe functional component associated with column 12 is disabled, thefunctional component is disabled regardless of the setting value in cell97. The values in mask array 10 can also be utilized in a variety ofalgorithms that account for a variety of considerations in determiningan operational characteristic setting that is implemented by afunctional component configuration controller.

Yield mask 20 provides an indication of functional components that aredisabled due to yield issues (e.g., defects). For example, yield mask 20includes operational characteristic setting values that cause functionalcomponents to be disabled if the functional components have amanufacturing defect. In one exemplary implementation, a functionalcomponent is permitted to be disabled if there is another operationalfunctional component that can handle the work flow.

Compatibility mask 30 provides an indication of operationalcharacteristics for functional components based upon compatibilityissues. For example, a particular processor and chip set can exchangeidentification with one another and based upon the exchange ofidentification, compatible supported functional component operationalcharacteristics can be enabled. In one embodiment of the presentinvention, compatibility is established by a driver and a correspondingoperational characteristic setting value is entered in compatibilitymask 30.

Performance mask 40 provides an indication of operationalcharacteristics for functional components based upon performance issues.For example, a particular application is being run and a value isentered into performance mask 40 enabling corresponding desirablesupported functional component operational characteristics. If theapplication is a graphics application additional graphics pipelines canbe enabled and/or the clock speed of existing graphics applicationpipelines can increase. In one embodiment of the present invention, thetype of the system can be factored into performance operational changes,for example in mobile devices a value entered in performance mask 40 candirect a performance adjustment to conserve power. For example, directchanges to operational characteristics of functional components,including disabling/enabling functional components, adjusting speed,voltage, etc.).

Self healing mask 50 provides an indication of operationalcharacteristics for functional components based upon field testingissues. For example, results from testing operations are utilized todetermine changes in operational characteristics for functionalcomponents. In one exemplary implementation, a field test indicates thatan enabled first functional component is defective. The operationalcharacteristic setting value in the self healing mask cell associatedwith the first functional component is changed to indicate the firstfunctional component is disabled and the operational characteristicsetting value in the self healing mask cell associated with a secondfunctional component that is disabled is changed to indicate the secondfunctional component is enabled. By changing the respective operationalcharacteristic setting values of the first and second functionalcomponents the defective first component is disabled and prevented fromproducing more problems and enabling a disabled second functionalcomponent allows the second functional component to perform the workflowthat would otherwise be routed to the first functional component andthus the system in effect heals itself in that the same work flow isstill able to be performed without defects.

FIG. 2 is a block diagram of a computer system 200, one embodiment of acomputer system upon which embodiments of the present invention can beimplemented. Computer system 200 includes central processor unit 201,main memory 202 (e.g., random access memory), chip set 203 with northbridge 209 and south bridge 205, removable data storage device 204,input device 207, signal communications port 208, and graphics subsystem210 which is coupled to display 220. Computer system 200 includesseveral busses for communicatively coupling the components of computersystem 200. Communication bus 291 (e.g., a front side bus) couples northbridge 209 of chipset 203 to central processor unit 201. Communicationbus 292 (e.g., a main memory bus) couples north bridge 209 of chipset203 to main memory 202. Communication bus 292 (e.g., the AdvancedGraphics Port interface) couples north bridge of chipset 203 to graphicsubsystem 210. Communication buses 294-297 (e.g., a PCI bus) couplesouth bridge 205 of chip set 203 to removable data storage device 204,input device 207, signal communications port 208 respectively. Graphicssubsystem 210 includes graphics processor 211 and graphics buffer 215.

The components of computer system 200 cooperatively operate to provideversatile functionality and performance. The operating characteristicsof functional components included in computer system 200 can changedynamically. In one exemplary implementation, the components of computersystem 200 cooperatively operate to provide predetermined types offunctionality, even though some of the functional components included incomputer system 200 may be defective. Communications buses 291, 292,293, 294, 295 and 297 communicate information. Central processor 201processes information. Main memory 202 stores information andinstructions for the central processor 201. Removable data storagedevice 204 also stores information and instructions (e.g., functioningas a large information reservoir). Input device 206 provides a mechanismfor inputting information and/or for pointing to or highlightinginformation on display 220. Signal communication port 208 provides acommunication interface to exterior devices (e.g., an interface with anetwork). Display device 220 displays information in accordance withdata stored in frame buffer 215. Graphics processor 211 processesgraphics commands from central processor 201 and provides the resultingdata to graphics buffers 215 for storage and retrieval by displaymonitor 220.

The operational configurations of the functional components included incomputer system 200 are flexibly adaptable to meet a variety ofobjectives. For example, operational configurations of the functionalcomponents included in computer system 200 are configurable to maintainexecution of a type of function even if some of the functionalcomponents are disabled. In one exemplary implementation, centralprocessor 201 and graphics processor 211 are still capable of executingthe same type of processing functions and main memory 202 storesinformation even through some of the functional components (e.g.,floating point component, pixel shader component, memory cell component,etc) are disabled. In one embodiment, the processors include a pluralityof functional components for performing processing operations. Theoperational characteristics of the functional components can be altered.In one embodiment, the processors include a plurality of functionalcomponents for performing processing operations, wherein defectivefunctional components included in the plurality of functional componentsare disabled. The processors also include a workflow control componentfor dispensing workflow to enabled processing components and preventingdistribution of workflow to the disabled defective components. In oneexemplary implementation, computer system 200 can continue to providefull functionality even through the functionality may be provided at areduced performance level (e.g., slower).

It is appreciated that the present invention can be implemented in avariety of embodiments. In one exemplary implementation the presentinvention can be utilized in processing systems utilized to provide avariety of graphics applications including video games. For example, thepresent invention can be utilized to disable defective components in agame console, personal computer, personal digital assistant, cell phoneor any number of platforms for implementing a video game. It is alsoappreciated that references to video game application implementationsare exemplary and the present invention is not limited to theseimplementations.

FIG. 3 is a block diagram of graphics pipeline 300 in accordance withOne embodiment of the present invention. Graphics pipeline 300 (e.g., apixel processing pipeline) comprises pipeline input 310, vertexprocessors 311 through 314, rasterizer 320, pixel shaders 321 through324, pre-raster operation (ROP)component 330, raster operationcomponents 331 through 334, pipeline output340 and functional componentconfiguration controller 350. Functionalcomponent configurationcontroller 350 is coupled to pipeline input 310, vertexprocessors 311through 314, rasterizer 320, pixel shaders 321 through 324,pre-rasteroperation (ROP) component 330, raster operation components 331through334, and pipeline output 340. Pipeline input 310 is coupled tovertex processors 311 through 314 which are coupled to rasterizer 320.Rasterizer 320 is coupled to pixel shaders 321 through 324 which arecoupled to pre-raster operation component 330. Pre-raster operation(ROP) component 330 is coupled to raster operation components 331through 334 which are coupled to pipeline output 340.In one embodiment,graphics pipeline 300 is similar to pipeline integrated circuit 150. Forexample, pipeline 171 can include vertex processor 311, pixel shader 321and ROP 331; pipeline 172 can include vertex processor 312, pixel shader322 and ROP 332; pipeline 173 can include vertex processor 313, pixelshader 323 and ROP 333; and pipeline 174 can include vertex processor314, pixel shader 324 and ROP 334 with pipeline input 310, rasterizer320, pre ROP 330 and pipeline output 340 common to pipelines 171-174.

The components of graphics pipeline 300 cooperatively operate to performgraphics pipeline operations even if some of the operationalcharacteristics of functional components in the pipeline are changed(e.g., disabled/enabled). Functional component configuration controller350 can change the operational characteristics of vertex processors 311through 314, pixel shaders 321 through 324, and/or raster operationcomponents 331 through 334. Functional component configurationcontroller 350 can make a variety of changes to the operationalcharacteristics, including enabling/disabling a functional component,changing the clock speed of the functional component and/or increase thevoltage supply to the functional component. The functional componentconfiguration controller 350 can make the changes for a variety ofreasons, including yield issues (e.g., the function component isdefective and/or associated with a defective component), compatibilityissues, performance issues and/or system “health” issues. Functionalcomponent configuration controller 350 also provides information onoperational characteristic changes to pipeline input 310, rasterizer320, pre-raster operation (ROP) component 330, and pipeline output 340.Pipeline input component 310 receives graphics pipeline information anddistributes corresponding packetized graphics pipeline information tovertex processors 311 through 314 remaining enabled. Vertex processors311 through 314 perform vector shading on the respectively receivedgraphics pipeline information and forward the resulting information torasterizer 320. Rasterizer 320 determines which pixels to shade anddistributes packetized vector shaded graphics pipeline information topixel shaders 321 through 324. Pixel shaders 321 through 323 performpixel shading calculations on the packetized vector shaded graphicspipeline information and forward the results to pre-raster operation(ROP) component 330.

In one embodiment, the pixel shaders 321 through 324 can also performtexture operations. The texture operations can be performed by textureshader components (e.g., corresponding to the pixel shaders). Pre-rasteroperation (ROP) component 330 gathers the vector shading information anddistributes packetized pixel shaded information to raster operationcomponents 331 through 334. Raster operation components 331 through 334perform additional rasterizing processing on the packetized pixel shadedinformation (e.g., performing color binding and Z buffer processing) andforwards the results to pipeline output 340. Pipeline output 340aggregates the graphics pipeline information into a single outputstream. Alternatively, the Functional Component Configuration Controller350 may be implemented as a cross bar or multiplexer structurepositioned between the respective levels of the functional components inthe pipeline.

The present invention can also be applied to portions of a frame bufferinterface that are split into multiple partitions. In one exemplaryimplementation, the frame buffer interface includes multiple similarmodules that operate as functional components that communicate with amemory (e.g., a portion of a DRAM that makes up the frame buffer). Ifone of the modules are defective it can be disabled and the workload ofthe defective module is reassigned to another module (e.g., based uponthe portion of the memory addresses associated with the module). Forexample, the mapping of frame buffer interface modules to memoryaddresses are remapped so that the entire memory is still available tothe chip.

FIG. 4 is a flow chart of functional component configuration process400, in accordance with one embodiment of the present invention.Functional component configuration process 400 facilitates flexibleconfiguration of functional components in an integrated circuit. Forexample, functional component configuration process 400 directs changesto the operational characteristics (e.g., enable, disable, change speed,change voltage, etc.) of functional components in an integrated circuit.It is appreciated that functional component configuration process 400can be utilized to reconfigure operational characteristics of afunctional component in accordance with a variety of objectives (e.g.,increase yield, provide flexible performance, facilitate self-healing,etc.). In one embodiment, functional component configuration process 400also facilitates efficient information processing workflow management.

In step 410, an indication of a functional component configuration(e.g., operational characteristic) alteration trigger event is received.In one embodiment of the present invention, the indication of thealteration trigger event is received by a functional componentcontroller (e.g., 120, etc.). The indication can include an indicationof the configuration change to be made (e.g., disable, enable,increase/decrease speed and/or voltage, etc.). In one embodiment, thefunctional component configuration alteration trigger event is receivedfrom an internal component of the integrated circuit (e.g., an internaltesting system, a driver, an application, etc.). The indication of afunctional component configuration alteration trigger event can also bereceived from a component external to the integrated circuit (e.g., anexternal testing system, the internet, a centralized configurationsystem, etc.).

It is appreciated that the indication and configuration alterationtrigger event can be associated with a variety of operational objectives(e.g., application, pay per use, market segmentation, etc.). Analteration trigger event can be associated with a yield issue. Forexample, the event can be associated with testing operations detecting adefective functional component and an indication identifying thedefective functional component is received (e.g., by a functionalcomponent controller). In one embodiment of the present invention, theindication of a defective functional component is received from atesting system. For example, an International Electrical and ElectronicEngineering (IEEE) Standard 1149.1 (also referred to as Joint TaskAction Group (JTAG) testing) compliant testing system and/or aproprietary operational integrity test (e.g., a proprietary scan testmechanism). An alteration trigger event can be associated with acompatibility issue. For example, a signal indicating a component has apredetermined compatibility is received. An alteration trigger event canbe associated with a performance issue. For example, a signal isreceived indicating a new and/or different application is being loaded,a pay per use authorization is granted, and/or the integrated circuit isincluded in a mobile device in which power conservation is desirable. Analteration trigger event can also be associated with a self test andhealing issue.

In step 420, a determination is made if an indicated functionalcomponent configuration alteration (e.g., operational characteristicalteration) is valid. For example, a determination of an authorizedoperational characteristic for the functional component is made. In oneembodiment, the indication received in step 410 is an encoded bitstream. The bit stream is decoded and the resulting value is examinedfor valid authorization to trigger a functional component configurationalteration. In one embodiment of the present invention, an encodedindicator is analyzed. The analysis includes decoding the indicator andcomparing it to a predetermined list of different possible operationalcharacteristic settings for the functional component. For example, thevalue of the decoded indicator is compared to values in a predeterminedlist of authorized trigger indications or values, wherein the values inthe list are associated with a particular operational characteristicsetting.

It one embodiment of the present invention, the functional componentconfiguration alteration action is also checked for validity. Forexample, when performing a functional component disablement inassociation with yield and self healing issues, in one embodiment adetermination is made if there is a second functional component (e.g.,in parallel) that can perform similar functions on the workflowinformation that would have otherwise went to a defective functionalcomponent. For example, a determination is made if a defectivefunctional component is one of a plurality of similar functionalcomponents. In one embodiment of the present invention, the type ofdefective component is compared to a list of multiple components thatprovide similar functions. For example, the defective component isidentified (e.g., a pixel shader, vertex processor, floating pointcomponent, etc.) and the identified functional component is comparedagainst a list of other similar components that can provide the samefunctionality. In one exemplary implementation, the other similarcomponents are examined to determine if they are parallel components tothe defective functional component. If there is a second functionalcomponent that can perform the workflow the first functional componentcan be disabled (e.g., if the first functional component is defective).

In step 430, a functional component configuration alteration isdirected. In one embodiment of the present invention, the functionalcomponent configuration alteration (e.g., operational characteristicalteration) is directed by a functional component controller (e.g., 120,152, 192, etc.). In one embodiment of the present invention, thefunctional component configuration change (e.g., disabling, enabling,etc.) is accomplished by programming a value (e.g., in a register) thatcontrols the configuration (e.g., operational characteristics) of thefunctional component. Based upon the value in the register a signal issent to the functional component which changes the configuration (e.g.,disables, enables, etc.) the component. In one exemplary implementation,the values are configured in a mask (e.g., mask10). It is appreciatedthat there are a variety of present invention methods for altering theconfiguration (e.g., altering operational characteristics) of afunctional component. For example, the disabling of a defectivefunctional component can accomplished by fusing communication lines tothe defective functional component. The defective functional componentcan also be disabled in manner that ensures the defective functionalcomponent does not generate spurious traffic. A receiving component canalso be notified of a defective component and programmed to ignoreinformation coming from the defective functional component. Functionalcomponent configurations can also be altered by soft coded methods.

In one embodiment, on going operations of the functional components aremonitored and factored into the configuration operations of step 430.For example, the system “health” is checked or tested and the resultsare utilized in determining changes to operational characteristics. Forexample, if a first functional component fails a self diagnostic testthe functional component can be disabled. If a second functionalcomponent is available it can be activated to “replace” the firstfunctional component. For example, if the second functional componentworks perfectly fine but was previously disabled for some other reason,it can be enabled to replace the functional component that failed thetest. In one exemplary implementation, application activation ismonitored and operational characteristics of functional componentsaltered accordingly. For example, if a high performance graphicsapplication is activated, the operational characteristics of functionalcomponents can be increased (e.g., faster clock setting) and/oradditional functional components (e.g., additional graphics pipelines)can be enabled or disabled.

Changes of components in a system (e.g., adding new components) can alsobe monitored and operational characteristics changed to accommodate thecomponent changes. For example, if a particular type of graphicsprocessor is coupled to a particular type of chip set, an identificationindication can be communicated and the operational characteristics offunctional components can be altered accordingly. The identificationpermits predetermination of compatibility and support for enhancedfeatures. In one embodiment, the identification is encoded. The encodingprevents malicious tampering with operational characteristic settings.For example, encoding provides protection from attempts atinappropriately reducing operational characteristics of functionalcomponents and/or increasing operational characteristics withoutcompatibility assurance which could otherwise potentially introducecomplex faults that are difficult to identify.

In one embodiment of the present invention, the operationalcharacteristic changes are coordinated amongst functional components.For example, a properly operating functional component that is closelyassociated with a changed functional component (e.g., in the samepipeline, thread, etc) can also be changed. In one exemplaryimplementation, operational changes are coordinated amongst functionalcomponents to maintain product differentiation. For example, if a lowerperformance chip is specified as having one less pixel shading componentand one less vertex shading component, both a pixel shading componentand a vertex shading component can be disabled to maintain productdifferentiation.

In step 440, workflow is diverted in accordance with the alteration to afunctional component. For example, the work flow can be diverted toother similar functional components. In one embodiment, diverting theworkflow is accomplished by providing notification of the configurationalteration (e.g., enablement, disablement, etc.) to a component thatotherwise communicates information to the altered functional component.For example, a functional component controller (e.g., 120, etc.)provides an indication of a functional component configurationalteration (e.g., change in operational characteristic) to adistribution component (e.g., 110, etc.) and the distribution componentroutes work flow information accordingly. For example, if a firstfunctional component is enabled workflow is routed or scheduled andforwarded to the first functional component. If a first functionalcomponent is disabled the workflow is routed or scheduled to anotherenabled functional component.

In one exemplary implementation, the workflow is diverted or routed tofaster or slower functional components. For example, workflow contentsare analyzed and parts of the workflow associated with higherperformance activities are routed to a faster functional component(e.g., a functional component operating at a higher clock rate) andparts of the workflow associated with lower performance activities arerouted to a slower functional component. Pixels in an area of graphicsimage that are changing rapidly (e.g., pixels towards the center of thedisplay) can be routed to a faster functional component (e.g., highclocked shader) and pixels in an area of graphics image that arechanging slowly (e.g., pixels towards the edge of the display) arerouted to a slower functional component (e.g., low clocked shader).

The functional component operational characteristic changes (e.g.,disabling, etc.) can be coordinated in a manner that reduces impacts toother components. In one embodiment, properly operating functionalcomponents can be programmed or reconfigured to be tolerant of possiblegarbage (e.g., illegal signal combinations) on the outputs of thedisabled components. For example, a properly operating functionalcomponent can be directed to ignore information from a disabledcomponent. A receiving component (e.g., collection component 140) canalso be notified of an operational characteristic change in a functionalcomponent and programmed to react accordingly. For example, if the speedof the functional component is lowered the receiving component can beprogrammed not to idle while waiting for information coming from thefunctional component but to check back later or if the functionalcomponent is disabled to ignore information from the functionalcomponent. If the functional component is disabled the receivingcomponent can be programmed to ignore signals from the functionalcomponent.

FIG. 5 is a flow chart of reduced performance circuit salvage method500, in accordance with one embodiment of the present invention. Reducedperformance circuit salvage method 500 facilitates redemption of diethat would otherwise be discarded. In one embodiment reduced performancecircuit salvage method 500 tests die and disables defective functionalcomponents in a manner that ensures the functionality of the die ismaintained.

In step 510, a chip is prepared for testing. A chip is placed in atesting system and the testing system is initialized. In one embodimentof the present invention, initial states for a scan test are entered inscan test cells. For example, the chip can be prepared for testing inaccordance with International Electrical and Electronic Engineering(IEEE) Standard 1149.1 (also referred to as Joint Task Action Group(JTAG) testing). In one embodiment of the present invention, a customtype of testing that is compatible with testing capabilities of the chip(e.g., a proprietary and/or non-JTAG-compliant testing) is utilized.

In step 520 the chip is tested. In one embodiment of the presentinvention the testing comprises identifying defective functionalcomponents of the chip. In one exemplary implementation of the presentinvention, a built in self test (BIST) is performed. For example, a scantest is included in the BIST in which test vectors are applied tostimulate certain aspects of a circuit (e.g., a functional logiccomponent) and the resulting output from the circuit is captured. Thescan test chain is designed to scan or shift scan test information(e.g., test vectors) to functional components in a circuit via a scantest chain, cause a functional component to perform an operation on thescan test information, capture the resulting information and then shiftthe resulting information out via scan test cells of the scan testchain. The resulting information is then analyzed for errors (e.g.,compared to predetermined correct results). The test vector patterns canbe provided by an automated test pattern generation (ATPG) tool.

In one embodiment of the present invention, particular functionalcomponents that are defective are identified. In one exemplaryimplementation, the output results of a scan test provide an indicationof which functional components are defective. For example, the testpattern results are analyzed and the defective functional componentsidentified. The present invention can determine if a defectivefunctional component is one which does not have another functionalcomponent included in the die that is similar. In one embodiment, adistinction is made if the defective functional component is criticaland/or the die does not have another functional component that canhandle the work flow if the defective functional component is disabled.If such a functional component is identified, the die is discarded inone embodiment of the present invention since the die could not providefull functionality.

In one embodiment of the present invention, disabling components areutilized to facilitate identification of a defective component. In oneexemplary implementation, test vector operations are performed by aplurality of similar functional components (e.g., pixel shaders 321through 324). If there is an erroneous result further testing isperformed. A first one of a plurality of functional components (e.g.,pixel shader 321) is disabled by a disabling component and test vectoroperations are performed by the remaining functional components.Alternatively, in the testing process software simulation can beutilized to simulate the disablement of a functional component. Forexample, pixel shader 321 is disabled and test vector operations areperformed by pixel shader 322 through 324 and the results analyzed. Ifthere are no erroneous results the first functional component isidentified as a defective component. If there are continued erroneousresults a second one of a plurality of functional components (e.g.,pixel shader 321) is disabled by a disabling component and test vectoroperations are performed by the remaining functional components. Ifthere are no erroneous results the second functional component isidentified as a defective component. The process of eliminationcontinues until the defective component is identified.

In step 530, a functional component configuration process (e.g.,functional component configuration process 400) is performed on the chipbased upon results of the testing. In one embodiment of the presentinvention, the functional component configuration process disables oneor more of a plurality of homogenous functional components (e.g.,execution components) of the chip if the functional components aredefective. For example, a disable signal is issued to the defectivefunctional component.

In one embodiment, reduced performance circuit salvage method 500includes programmably reconfiguring the chip to permit other functionalcomponents to perform the functions of the disabled functionalcomponent. For example, a mask is programmed into a distributingcomponent that identifies disabled functional components and the workflow can be distributed between the remaining functional components. Itcan be programmed as either a software loadable register or a hardcodedmask type program that is performed at test time. There are a variety oftechniques that can be utilized including programmable non-volatilememory, fuses, wire bond straps, etc.

In one embodiment of reduced performance circuit salvage method 500, aprogram in the tester includes definitions of characteristics of a diefor a particular performance level. In one exemplary implementation, thetester includes an indication of what defects are permissible in eachperformance level. For example, the tester can include a firstperformance level in which a first plurality of parallel functionalcomponents can be disabled and a second performance level in which asecond plurality of parallel functional components can be disabled. Theperformance level can also correspond to the number of functionalcomponents that are enabled. The present invention can also facilitateautomatic binning of the die based upon performance levels as part ofthe testing procedure.

FIG. 6 is a block diagram of testing environment 600, a testingenvironment in accordance with one embodiment of the present invention.Testing environment 600 includes die 610 and testing system 650. Die 610comprises, testing interface 633, distributor 631 and functionalcomponents 611 through 614, with each functional component anddistributor 631 including scan test cells 621 through 625 respectively.Die salvage testing system 650 comprises testing module 680 anddefective component resolution module 670, which includes functionalitymaintenance module 671, corresponding component detection module 672,disabling module 673 and die rejection module 674.

Die salvage testing system 650 tests die 610. Testing module 680provides test vectors to testing interface 633 which passes the testvectors on to scan test cells 621 through 625. The information in scantest cells 621 through 625 are fed into functional components 611through 614 and distributor 631, which perform an operation on the scantest information. The results are also captured by scan test cells 621through 625 and communicated to testing interface 633 which passes themto testing system 650 for analysis. Testing module 680 analyzes theresults and provides an indication of defective functional components todefective resolution module 670. Defective resolution module 670determines if a die can be salvaged by disabling functional components.

Functionality maintenance module 671 determines if the identifiedfunctional component is included in a group that is permitted to bedisabled. In one embodiment, functionality maintenance module 671determines if there are other functional components that can handle theworkflow of the identified (e.g., defective) functional component. Forexample, the workflow can be transferred or rerouted to anotherfunctional component. In one exemplary implementation, functionalitymaintenance module 671 checks the identified functional componentagainst a predetermined list of components that are allowed to bedisabled (e.g., other components can handle the workflow).

Corresponding component detection module 672 determines if there arerelated functional components that should be disabled. The relatedfunctional components can be properly functioning components. In oneembodiment of the present invention, a functional component that isclosely associated with a defective functional component (e.g., in thesame pipeline, thread, etc.) is identified. For example, if thefunctional component is downstream from a defective component, theproperly functioning component can be disabled (e.g., powered down) toprevent switching activities and corresponding power consumption. In oneexemplary implementation, functional components can be disabled tomaintain product differentiation. If other functional components thatshould be disabled are identified, the identity of these components isfed back into functionality maintenance module 671 to determine ifdisabling them would impact functionality.

Disabling module 673 directs functional component disablement (e.g.,disablement of functional components 611, 612, 613 or 614). In oneembodiment of the present invention, disabling module 673 sends adisablement signal directly to a functional component via the testinterface 633. In an alternate embodiment, disabling module 673 sends asignal to a disabling component (not shown) in die 610. Disabling module673 disables a functional component if functionality maintenance module671 provides an indication that it is permissible to disable thecomponent (e.g., it will not eliminate functionality). In one exemplaryimplementation, functionality maintenance module 671 allows disablingmodule 673 to disable a functional component even if it reducesperformance, as long as it does not reduce functionality.

Die marking module 674 marks a die. In one embodiment of the presentinvention, die marking module 674 marks a die based upon a performancecriteria. Die marking module 674 also provides a marking or indicationif a die is rejected. The die can be rejected because functionalitymaintenance module 671 provides an indication that a defectivefunctional component should not be disabled and/or the performance ofthe die drops below a predetermined level. In one exemplaryimplementation, a die is marked based upon the functional componentsthat are disabled. For example, if a predetermined number and/or type offunctional component is disabled the die is marked accordingly.

In one embodiment of the present invention, die marking module 674 alsomarks a wafer upon which the die is located. In one embodiment of thepresent invention, die marking module 674 marks a wafer based upon ayield criteria. The yield criteria can be segmented for differenceperformance levels. For example, the yield marking can indicate that acertain number or percentage of the die in a wafer have no disabledfunctional components, a certain number or percentage of die have a setnumber of disabled functional components, and a certain number or dieare rejected or unsalvageable.

FIG. 7 is a flow chart of die classification process 700, one embodimentof a die classification process in accordance with one embodiment of thepresent invention. Die classification process 700 involves themanufacturing and classification of die with similar configurations atdifferentiated performance levels. In one exemplary implementation, diethat are manufactured in the same fabrication process are classifiedbased upon different performance levels. For example, die have the samenumber of functional components (e.g., transistors) but some aredisabled in a manner that does not prevent execution of a function butmay impact performance. Die classification process 700 facilitates theclassification and distribution of dies with the same functionality anddifferent performance levels.

In step 710, a plurality of die with similar configurations arefabricated. In one embodiment of the present invention, the plurality ofdie are fabricated on a single wafer. In one embodiment of the presentinvention, the similar configurations enable each of the plurality ofdie to perform a predetermined type of functionality. In one exemplaryimplementation, the same lithographic process steps are utilized tofabricate the plurality of die. In one embodiment, similar configurationcan be determined by reviewing data sheet information on the die. Forexample, the data sheet information can include the die size (e.g.,number of transistors), functionality indicators, and/or performanceindicators, and/or information on product lines the die is associatedwith (e.g., by determining what the die is sold for). Similarconfiguration can also be indicated if the dies have substantially thesame fabrication costs.

In step 720, a component is prevented from participating in productivecontribution within one of the plurality of die without eliminating theability of the die to perform a function associated with the component.In one embodiment of the present invention, the removal of componentproductivity may impact performance but does not eliminate the type offunctionality. In one exemplary implementation, the component isprevented from participating in productive contribution by disabling thecomponent. The work flow of the disabled component can be redirected toother components. In one embodiment, preventing a component fromparticipating in productive contribution can be detected by analyzingdata sheet information. For example, if a die has a product sheetapplicable to a product line that provides the same types offunctionality at different performance levels. Alternatively, anotherindication of whether a component is prevented from participating inproductive contribution is if a determination of which data sheetinformation applies to a die is not made until after testing isperformed (e.g., selection of a data sheet information corresponds toalterations in the die components based upon the results of testing).

Each of the plurality of die are classified in step 730 based ondifferentiated performance levels for the functionality. In oneexemplary implementation, the die are included in products that aredistributed or sold at different prices in correlation to theperformance level at which the functionality is provided. Dies with thesame design are distributed with different performance levels (e.g.,different speeds, bandwidth, etc.) in one embodiment of the presentinvention.

FIG. 8 is a block diagram of processing unit 800 in accordance with oneembodiment of the present invention. In one embodiment of the presentinvention, processing unit 800 is included in a computer based system(e.g., computer system 200). In one exemplary implementation, processingunit 800 is similar to central processing unit 201 and/or graphicsprocessing unit 211. Processing unit 800 comprises allocation component810, performance management state component 820 and operation components831 through 834. In one embodiment, allocation component 810 is similarto distribution component 110, performance management state component820 is similar to functional component controller 120, and operationcomponents 831-834 are similar to functional components 131-134. Each ofthe operation components 831 through 834 perform processing operationsassociated with various tasks (e.g., floating point calculations,graphics data manipulation, etc.). In one embodiment, the operationcomponents 831-834 perform similar tasks or functions. Performancemanagement component 820 selectively manages changes in the operationalcharacteristics (e.g., enables, disables, etc.) of each one of theoperation components 831 through 834. Allocation component 810 iscoupled to operation components 831 through 834 and performancemanagement component 820. Allocation component 810 allocates informationto each one of the functional components 831 through 834 that areenabled. For example, allocation component 810 allocates (e.g.,distributes) processing work flow information to operation component 831through 834 if the operation component is enabled. In one embodiment,performance management state component 820 and operation components 831through 834 are similar to functional component controller 120 andfunctional components 831-834.

Performance management component 820 receives information indicating achange to operation components. For example, a test result indicatesthat an operation component is defective. Performance managementcomponent 820 identifies a subset of operation components 831 through834 that the information applies to. For example, a subset of operationcomponents that are defective and that subset is not enabled for use. Inone exemplary implementation, a subset that is not defective is enabled.For example, if testing results indicate that operation component 831and 834 are defective then operation component 820 enables operationcomponent 832 and 833 but does not enable operation component 831 and834. If operation component 831 and 834 are enabled performancemanagement component 820 disables them. Performance management component820 also provides an operational characteristic status indication toallocation component 810. For example, the operational characteristicstatus indication indicates which of the functional components isenabled and which is disabled. Each of the operation components that areenabled are capable of executing similar functions that would otherwisebe executed by the operation components that are not enabled.

FIG. 9 is a flow chart of wafer yield optimization method 900 inaccordance with one embodiment of the present invention. Wafer yieldoptimization method 900 increases the yield of useable die from a wafer.In one exemplary implementation, wafer yield optimization method 900facilitates salvaging of die with defective components that wouldotherwise be discarded from a wafer to increase the overall yield from awafer.

In step 910, a wafer is fabricated. The wafer includes a plurality ofdie and each one of the plurality of die have a functional componentcapable of performing a plurality of sub-tasks in parallel using aplurality of functional sub-components. For example, each die caninclude a pipeline that performs a variety of graphics sub-tasks (e.g.,shading, texturing, aliasing, rasterizing, etc.) by functionalsub-components (e.g., a shader, a rasterizer, etc). In one embodiment ofthe present invention the wafer is fabricated using lithographicprocesses.

In step 920, for each die each one of the plurality of functionalsub-components that are operable and each one of the plurality offunctional sub-components that are not operable are identified. In oneembodiment, the operable and non operable functional sub-components areidentified as part of a conventional circuit testing process. Forexample, predetermined input are fed into a functional sub-component andthe resulting output is examined. The output information is examined forerrors (e.g., the output is compared to predetermined correct results).If the output information includes an error (e.g., if the output doesnot match predetermined correct results) the functional sub-component isidentified as not operable.

In step 930, operation of each one of said plurality of functionalsub-components that are identified as not operable is disabled. In oneembodiment, each one of said plurality of functional sub-components thatare identified as operable can be enabled. In one embodiment, the nonoperable functional sub-components are disabled and operable functionalsub-components are enabled by a hard “coded” mechanism. For example,foundry laser trim bits are utilized to configure or disable functionalsub-components. In another embodiment, software programmable informationis utilized to configure (e.g., disable or enable) functionalsub-components.

In step 940, each one of the plurality of die are sorted into aperformance class based on the operable status (e.g., componentsidentified as operable or not operable in step 930). For example, thedie can be sorted into a high performance class in which all or asignificant percentage of the functional sub components are operable andenabled. The die can be sorted into a medium performance range class inwhich less of the functional sub-components remain enabled. Theseperformance ranges can be designated as salvageable. There can also be aperformance class in which the die do not meet a minimum and arediscarded (or subjected to some other corrective action to possibly fixthe problem).

In step 950, the die sorted in a performance class designed assalvageable are salvaged. For example, a die with some disabledfunctional sub components is used to perform processing tasks, eventhough the speed at which the tasks are performed is reduced.

FIG. 10 is a block diagram of functional component remote configurationarchitecture 1100, in accordance with one embodiment of the presentinvention. Functional component remote configuration architecture 1100facilitates configuration of functional components included in anintegrated circuit die. For example, the configuration is controlledfrom an external or remote system. Functional component remoteconfiguration architecture 1100 provides an architecture in whichoperational characteristics of a functional component can be altered ina secure and controlled manner to achieve a number of desirableimplementations.

Remote configuration environment 1100 includes integrated circuit die1110 and remote configuration control module 1150. Integrated circuitdie 1110 comprises, configuration module 1133, distribution component1131 and functional components 1111 through 1114, with each functionalcomponent and distribution component 1131 including operationalcharacteristic registers 1121 through 1125 respectively. Remoteconfiguration controller module 1150 comprises encoding module 1180 andconfiguration resolution module 1170.

Remote configuration controller module 1150 controls configuration offunctional components in integrated circuit die 1110. In one embodiment,remote configuration controller module 1150 is off chip (e.g., in adriver). Configuration resolution module 1170 determines the operationalcharacteristic settings for functional components of integrated circuitdie 1110. In one exemplary implementation, configuration resolutionmodule 1170 participates in an automated functionality negotiationprocess (e.g., capacity on demand) in which agreement is reached onupgraded operational characteristics and a functionality indicator isdynamically changed as part of the functionality negotiation process.The operational characteristics are set to maintain productdifferentiation in one exemplary implementation. Configurationresolution module 1170 forwards an operational characteristic indicatorvalue to encoding module 1180. Encoding module 1180 encodes theoperational characteristic indicator value (e.g., with a key, hashvalue, etc.) and forwards the encoded operational characteristicindicator value to configuration module 1133.

Configuration module 1133 directs functional component configuration.For example, configuration module 1133 directs changes to functionalcomponent operational characteristic settings (e.g., for functionalcomponents 1111, 1112, 1113 or 1114) based upon the encoded operationalcharacteristic setting value received from encoding module 1180.Configuration module 1133 can decode the functional component operationcharacteristic indicator value. Configuration module 1133 forwards thedecoded value to functionality tracking module 1137 for comparison to acorresponding operational characteristic setting.

Functionality tracking module 1137 directs maintenance of functionalcomponent operational characteristics. In one exemplary implementation,functionality tracking module 1137 provides a correlation between adecoded functionality indicator value and a particular operationalcharacteristic setting. For example, functionality tracking module 1137checks a functionality indicator against a predetermined correlationlist of operational characteristic settings. Functionality trackingmodule 1137 can also determine if there are other functional componentsthat can handle workflow of an identified functional component.

FIG. 11 is a flow chart of remote reconfiguration method 1200 inaccordance with one embodiment of the present invention. Remotereconfiguration method 1200 provides a mechanism for maintaining remotecontrol of reconfiguration operations. In one exemplary implementation,remote reconfiguration method 1200 is utilized in a pay per use processwherein utilization of certain configuration features require additionalpayments. For example, if a user desires additional functionalcomponents to be activated (e.g., additional graphics pipelines,floating point components, etc.) the user has to make additionalpayments.

In step 1210, a die functional component reconfiguration request processis engaged in wherein a system requests a reconfiguration code from aremote resource. In one embodiment, a reconfiguration request processincludes requesting and receiving a die functional componentreconfiguration code. In one exemplary implementation, the diereconfiguration code is utilized by a functional component controller(e.g., 120, etc.) to reconfigure functional components. It isappreciated the request and receipt of a die functional componentreconfiguration code can be communicated via a variety of communicationsystems. For example, the request and the die functional componentreconfiguration code can be communicated via the Internet. In oneembodiment, the request includes a reconfiguration code permissionindicator that indicates the requester is authorized to receive areconfiguration code (e.g., the requester has made a requisite payment,has an authorized system, etc.).

In one embodiment, the die functional component reconfiguration requestprocess includes a reconfiguration code permission indicator requestprocess to obtain a reconfiguration code permission indicator. In oneexemplary implementation, the reconfiguration code permission indicatorrequest process comprises forwarding a payment and request for apermission indicator and receiving a response to the request and paymentfor the permission indicator. For example, a customer or user makes anelectronic payment via the internet to a remote central resource andreceives a permission indicator (e.g., bit stream code) in return.

In step 1220, a reconfiguration code production process is executed. Inone exemplary implementation, a remote resource processes the requestfor the reconfiguration code. In one embodiment, the reconfigurationcode production process comprises receiving a request for areconfiguration code and a permission indicator, analyzing validity ofthe permission indicator, and providing a reconfiguration code if thepermission indicator is valid. For example, a remote resource receives arequest to increase the number of graphics pipelines activated in asystem. The remote resource analyzes if the requester has made arequisite payment. If the requisite payment has been made the remoteresource forwards the reconfiguration code for increasing the number ofgraphics pipelines activated in a system.

In one embodiment, a reconfiguration code production process includesengaging in a reconfiguration code permission indicator response processto respond to a request process to obtain a reconfiguration codepermission indicator. In one exemplary implementation thereconfiguration code permission indicator response process includesreceiving payment for a permission indicator and forwarding thepermission indicator in response to receiving the payment.

In step 1230, a die functional component reconfiguration process isperformed if the reconfiguration code is received by a system (e.g.,received from a remote resource). The die functional componentreconfiguration process includes reconfiguring a die functionalcomponent (e.g., functional component 131, 132, 133, 134, etc.) inaccordance with the reconfiguration code. In one embodiment the diefunctional component reconfiguration process is similar to functionalcomponent configuration process 400.

Thus, the present invention enables flexible operational configurationof integrated circuit dies and enhances product differentiation. Thedies can be utilized in a product line with multiple performance levels.The present invention also facilitates the manufacture of single diecapable of being dynamically configured for high performance tasks orlow performance tasks permitting power savings and economicdifferentiation. The present invention also facilitates conservation ofmanufacturing resources and salvaging of dies with defective components.

The foregoing descriptions of specific embodiments of the presentinvention have been presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed, and obviously manymodifications and variations are possible in light of the aboveteaching. The embodiments were chosen and described in order to bestexplain the principles of the invention and its practical application,to thereby enable others skilled in the art to best utilize theinvention and various embodiments with various modifications as aresuited to the particular use contemplated. It is intended that the scopeof the invention be defined by the claims appended hereto and theirequivalents.

What is claimed is:
 1. A reduced performance circuit salvage methodcomprising: preparing a chip for testing; testing said chip; andperforming a functional component configuration process on said chip andbased upon results of said testing configuring said chip as a reducedperformance circuit, wherein tasks are performed at a differentperformance level in said chip configured as said reduced performancecircuit and said chip still be classified as a useful chip, and whereinsaid functional component configuration process comprises: receiving artindication of a defective functional component; determining if saiddefective functional component is one of a plurality of similarfunctional components; disabling said defective functional component ifit is one of said plurality of similar functional components; enablingone or more non-defective functional components; and providingnotification of said disabling and said enabling to a second componentother than said defective functional component, wherein said secondcomponent is configured to communicate information to at least one ofsaid plurality of similar functional components and bypass saiddefective functional component to which said second component wouldotherwise communicate information.
 2. The reduced performance circuitsalvage method of claim 1 wherein said testing comprises: identifying adefective functional component; determining if there is a non-defectivefunctional component included in said integrated circuit, wherein saidnon-defective functional component performs a similar function as saiddefective functional component; designating said defective functionalcomponent for non use if said non-defective component is included insaid integrated circuit; and marking said integrated circuit asdefective if said non-defective component that perform said similarfunction in not is included in said integrated circuit.
 3. The reducedperformance circuit salvage method of claim 1 wherein one of a pluralityof homogenous execution components of said chip is disabled or enabledand said disabling said defective functional component results in saidchip performing said tasks slower.
 4. The reduced performance circuitsalvage method of claim 1 further comprising reconfiguring said chip topermit other functional components to perform functions of said disabledfunctional component at said different performance level, wherein saiddifferent performance level corresponds to the number of enabled saidnon-defective functional components.
 5. The reduced performance circuitsalvage method of claim 1 wherein said indication of a defectivefunctional component is received from a testing system.
 6. A dieclassification process comprising: fabricating a plurality of die withsimilar configurations; preventing a component from participating inproductive contribution within one of said plurality of die withouteliminating the ability of said one of said plurality of die to performa function associated with said component and classifying said pluralityof die in classes based on differentiated performance levels for saidfunctionality, wherein die in said classes are considered useful whereina first die and a second die included in said plurality of die areincluded in different products that are sold at different prices incorrelation to a performance level at which functionality is provided,and wherein a determination of which manufacturer data sheet informationapplies to a die included in said plurality of die is not made untilafter testing is performed.
 7. The die classification process of claim 6wherein said plurality of die are fabricated on a single wafer.
 8. Thedie classification process of claim 6 wherein similar configuration isdetermined by reviewing manufacturer data sheet information on saidplurality of die.
 9. The die classification process of claim 6 whereinsimilar configuration is determined if dies have substantially the samefabrication costs.
 10. The die classification process of claim 6 whereinsaid component is prevented from participating in productivecontribution by disabling said component.
 11. The die classificationprocess of claim 6 wherein each one of said plurality of dies arefabricated with the same design and are distributed with differentperformance levels.
 12. A die classification process comprising:fabricating a plurality of die with similar configurations, whereinsimilar configuration is determined if dies have substantially the samefabrication costs; preventing a component from participating inproductive contribution within one of said plurality of die withouteliminating the ability of said one of said plurality of die to performa function associated with said component; and classifying saidplurality of die based on differentiated performance levels for saidfunctionality, wherein a first die and a second die included in saidplurality of die are included in different products that are sold atdifferent prices in correlation to a performance level at witchfunctionality is provided.
 13. The die classification process of claim12 wherein said component is prevented from participating in productivecontribution by disabling said component.
 14. The die classificationprocess of claim 12 wherein a determination of which data sheetinformation applies to a die included in said plurality of die is notmade until after testing is performed.
 15. The die classificationprocess of claim 12 wherein each one of said plurality of dies arefabricated with the same design and are distributed with differentperformance levels.
 16. The die classification process of claim 12wherein said one of said plurality of die is reconfigured to permitother functional components to perform functions of said disabledfunctional component.